Large-size Functional Wafer Temporary Bonding and Thinning

Authors

Qing Wan (ORCID: https://orcid.org/0000-0002-4930-0958)
Yixin Zhu
Z.M. Yu (ORCID: https://orcid.org/0009-0006-0623-3288)

Publication Details

Journal: Journal of Inorganic Materials
Published: 2025-01-01
DOI: https://doi.org/10.15541/jim20250241
Primary Topic: 3D IC and TSV technologies
Type: article
Field-Weighted Citation Impact: 0.00

Funders

National Natural Science Foundation of China
Natural Science Foundation of Zhejiang Province

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article

Large-size Functional Wafer Temporary Bonding and Thinning

Qing Wan, Yixin Zhu, Z.M. Yu

Jan 1, 2025

1 links

Journal of Inorganic Materials

3D IC and TSV technologies

article

Large-size Functional Wafer Temporary Bonding and Thinning

Qing Wan, Yixin Zhu, Z.M. Yu

January 1, 2025article en

Abstract

No abstract available for this paper.

Journal of Inorganic MaterialsVol. 40(12)

National Natural Science Foundation of China, Natural Science Foundation of Zhejiang Province

Openalex Percentile: Top 87%

3D IC and TSV technologies

DOI Open Access PDF OpenAlex

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Large-size Functional Wafer Temporary Bonding and Thinning — Qing Wan, Yixin Zhu, et al. · Journal of Inorganic Materials (2025) | TGRS Research Map | TGRS