Thermal and Parasitic Inductance Analysis of Pcbembedded Power Modules for Electric Vehicle Applications

The rapid development of new energy vehicles, particularly electric vehicles (EVs), has led to a strong demand for power modules with compact structures, low thermal resistance, and minimal parasitic inductance. PCB-embedded packaging technology exhibits these advantages and holds great potential for widespread application. In this study, thermal analysis and parasitic inductance evaluation were conducted on the designed lateral and vertical layout embedded packaging structures, including copper lead-frame and AMB substrate configurations. The results indicate that the AMB substrateembedded packaging structure achieves lower thermal resistance, whereas the thermal resistance of the copper leadframe embedded packaging structure can be further improved by increasing the d/p ratio. In terms of parasitic inductance, the vertical layout structure, which leverages the principle of mutual inductance cancellation, demonstrates superior performance with a parasitic inductance of less than 1 nH.