Enhanced Thermal-Resistant Fingerprint Model for Device Identification in OWC System

As the deployment of optical wireless communication (OWC) technology continues to expand, the demand for robust and reliable device identification methods has become crucial. This paper presents an enhanced thermal-resistant fingerprint model tailored for device identification within OWC systems. By conducting an in-depth analysis of traditional physic-based fingerprints, a temperature-independent fingerprint feature model is proposed to address the distortion of temperature fluctuations on fingerprints. Through extensive simulations and experimental validation, it is demonstrated that the proposed model significantly enhances identification performance, achieving higher accuracy compared to existing physics-based fingerprints. The results indicate the model’s applicability in practical OWC scenarios, underscoring its potential to improve security and efficiency in optical communication.