A Highly-Integrated 64-QAM Ku-Band Transceiver in SiGe BiCMOS for 6G Cell-Free MIMO
We present a highly-integrated transceiver system-on-chip (SoC) intended for Ku-band backhaul applications in the 12-14GHz frequency range. The chip is realized using Infineon’s 0.13μm SiGe BiCMOS technology and encapsulated in a wafer-level eWLB package. The many blocks comprising the circuit achieve competitive performance in measurement, such as an integrated VCO with a phase noise below -110dBc/Hz at a 1MHz offset, a receiver gain of 19dB and a transmitter with an output power of up to 16dBm. The chip also integrates a VGA and I/Q modulators in the TX chain, frequency dividers, LO multiplexers for an external LO feed, LO leakage cancellation circuitry and an SPI interface. The chip operates from a single 3.3V power supply, consuming 1.49W in transmit mode and 0.67W in receive mode, with the capability to support spectrally-efficient modulation schemes up to 64-QAM and data-rates up to 1.2Gb/s with the 16-QAM modulation.
Authors
- Meghana Kadam (ORCID: https://orcid.org/0000-0002-4258-1945)
- Вадим Іссаков (ORCID: https://orcid.org/0000-0003-3450-8745)
- H.-D. Wohlmuth
- Finn Stapelfeldt
- Paulo Coelho de Oliveira (ORCID: https://orcid.org/0000-0002-9982-8478)
- A. Engelhardt
Institutions
- Infineon Technologies (Germany) (DE)
- Technische Universität Braunschweig (DE)
Publication Details
- Published
- 2025-05-25
- DOI
- https://doi.org/10.1109/iscas56072.2025.11043963
- Primary Topic
- Radio Frequency Integrated Circuit Design
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Ministry of Education