A Highly-Integrated 64-QAM Ku-Band Transceiver in SiGe BiCMOS for 6G Cell-Free MIMO

We present a highly-integrated transceiver system-on-chip (SoC) intended for Ku-band backhaul applications in the 12-14GHz frequency range. The chip is realized using Infineon’s 0.13μm SiGe BiCMOS technology and encapsulated in a wafer-level eWLB package. The many blocks comprising the circuit achieve competitive performance in measurement, such as an integrated VCO with a phase noise below -110dBc/Hz at a 1MHz offset, a receiver gain of 19dB and a transmitter with an output power of up to 16dBm. The chip also integrates a VGA and I/Q modulators in the TX chain, frequency dividers, LO multiplexers for an external LO feed, LO leakage cancellation circuitry and an SPI interface. The chip operates from a single 3.3V power supply, consuming 1.49W in transmit mode and 0.67W in receive mode, with the capability to support spectrally-efficient modulation schemes up to 64-QAM and data-rates up to 1.2Gb/s with the 16-QAM modulation.

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Published
2025-05-25
DOI
https://doi.org/10.1109/iscas56072.2025.11043963
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
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article

A Highly-Integrated 64-QAM Ku-Band Transceiver in SiGe BiCMOS for 6G Cell-Free MIMO

Meghana Kadam, Вадим Іссаков, H.-D. Wohlmuth, Finn Stapelfeldt et al.
Radio Frequency Integrated Circuit Design
article

A Highly-Integrated 64-QAM Ku-Band Transceiver in SiGe BiCMOS for 6G Cell-Free MIMO

Meghana Kadam, Вадим Іссаков, H.-D. Wohlmuth, Finn Stapelfeldt, Paulo Coelho de Oliveira, A. Engelhardt
article en

Abstract

We present a highly-integrated transceiver system-on-chip (SoC) intended for Ku-band backhaul applications in the 12-14GHz frequency range. The chip is realized using Infineon’s 0.13μm SiGe BiCMOS technology and encapsulated in a wafer-level eWLB package. The many blocks comprising the circuit achieve competitive performance in measurement, such as an integrated VCO with a phase noise below -110dBc/Hz at a 1MHz offset, a receiver gain of 19dB and a transmitter with an output power of up to 16dBm. The chip also integrates a VGA and I/Q modulators in the TX chain, frequency dividers, LO multiplexers for an external LO feed, LO leakage cancellation circuitry and an SPI interface. The chip operates from a single 3.3V power supply, consuming 1.49W in transmit mode and 0.67W in receive mode, with the capability to support spectrally-efficient modulation schemes up to 64-QAM and data-rates up to 1.2Gb/s with the 16-QAM modulation.

Infineon Technologies (Germany) (DE), Technische Universität Braunschweig (DE)
Ministry of Education
Affordable and clean energy
Openalex Percentile: Top 87%
Radio Frequency Integrated Circuit Design
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A Highly-Integrated 64-QAM Ku-Band Transceiver in SiGe BiCMOS for 6G Cell-Free MIMO — Meghana Kadam, Вадим Іссаков, et al. · (2025) | TGRS Research Map | TGRS