A revisit on the Reliability Test for Conductive Anodic Filament failure for Printed Circuit Boards in High Humidity
This study revisits the reliability test for printed circuit board (PCB) Conductive Anode Filament (CAF) reliability under high humidity and temperature. However, the suggested test coupons could also introduce dendrite growth, and corrosion simultaneously, rendering complexity in lifetime prediction for CAF. Suggestion on the test coupons design will be discussed if separate failure mechanism is to be studied.
Authors
- D. Banerjee
- Cher Ming Tan (ORCID: https://orcid.org/0000-0002-6330-3899)
- W. Huang (ORCID: https://orcid.org/0000-0002-3638-0629)
- E. Chen (ORCID: https://orcid.org/0000-0002-9702-7757)
- Rajarshi Sarkar (ORCID: https://orcid.org/0000-0003-1281-7993)
- D. Y. Cheng
Institutions
- Chang Gung University (TW)
Publication Details
- Published
- 2025-04-23
- DOI
- https://doi.org/10.1109/raeeucci63961.2025.11048256
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.00