A 23–29 GHz 3-stack Power Amplifier in 22nm FD-SOI CMOS Technology

A 23–29 GHz power amplifier (PA) based on a stacked field-effect transistor (FET) topology is proposed. To achieve higher output power and gain, the output stage employs a triple-stacked FET design. To improve stacking efficiency, neutralization capacitors are added between the differential common-source (CS) amplifiers to compensate for phase mismatches at the stack nodes. Round-table and vertical gate repetition techniques are applied to achieve a compact layout and enhance the PA’s power density. The proposed PA is fabricated using the 22nm FD-SOI process. Measurement results show that the proposed PA delivers a peak saturated power (P<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">sat</inf>) of 19.6 dBm, with a core area of only 0.047 mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>, achieving a power density of 1936.2 mW/mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>.

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Published
2025-05-25
DOI
https://doi.org/10.1109/iscas56072.2025.11043519
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
Field-Weighted Citation Impact
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article

A 23–29 GHz 3-stack Power Amplifier in 22nm FD-SOI CMOS Technology

Zhenghe Feng, Yuhang Zhang, Zixuan Wang, Wenhua Chen et al.
Radio Frequency Integrated Circuit Design
article

A 23–29 GHz 3-stack Power Amplifier in 22nm FD-SOI CMOS Technology

Zhenghe Feng, Yuhang Zhang, Zixuan Wang, Wenhua Chen, Yudi Yang, Jiewen Wang, Kun Gao
article en

Abstract

A 23–29 GHz power amplifier (PA) based on a stacked field-effect transistor (FET) topology is proposed. To achieve higher output power and gain, the output stage employs a triple-stacked FET design. To improve stacking efficiency, neutralization capacitors are added between the differential common-source (CS) amplifiers to compensate for phase mismatches at the stack nodes. Round-table and vertical gate repetition techniques are applied to achieve a compact layout and enhance the PA’s power density. The proposed PA is fabricated using the 22nm FD-SOI process. Measurement results show that the proposed PA delivers a peak saturated power (P<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">sat</inf>) of 19.6 dBm, with a core area of only 0.047 mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>, achieving a power density of 1936.2 mW/mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>.

Tsinghua University (CN)
National Science Fund for Distinguished Young Scholars
Affordable and clean energy
Openalex Percentile: Top 87%
Radio Frequency Integrated Circuit Design
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A 23–29 GHz 3-stack Power Amplifier in 22nm FD-SOI CMOS Technology — Zhenghe Feng, Yuhang Zhang, et al. · (2025) | TGRS Research Map | TGRS