Scaling Co-Packaged Optical Interconnects Using Hybrid 2.5D/3D Integration
Tightly integrated optical interconnects can provide high-bandwidth, energy-efficient inter-node communication. We describe a novel system which uses hybrid 2.5D/3D integration to compose a state-of-the-art FPGA compute chiplet, three electrical interface chiplets, and three photonic interface chiplets. We use register-transfer-, gate-, transistor-, and device-level simulations to demonstrate the potential for this system to achieve 96Tb/s of bi-directional bandwidth, and we experimentally demonstrate key components including a complete opto-electrical channel. Our results provide a strong case for hybrid 2.5D/3D integration as the key enabler for scaling co-packaged optical interconnects.
Authors
- Alyosha Christopher Molnar (ORCID: https://orcid.org/0000-0001-7674-1874)
- Yanghui Ou (ORCID: https://orcid.org/0000-0001-9481-9882)
- Devesh Khilwani (ORCID: https://orcid.org/0009-0007-8129-6382)
- Austin Rovinski (ORCID: https://orcid.org/0000-0003-1761-1898)
- Christine Ou
- Keren Bergman (ORCID: https://orcid.org/0000-0001-8580-1728)
- Christopher Batten (ORCID: https://orcid.org/0000-0002-2835-667X)
- Yuyang Wang (ORCID: https://orcid.org/0000-0002-4242-8879)
- Sunwoo Lee (ORCID: https://orcid.org/0000-0001-6334-3068)
- Songli Wang (ORCID: https://orcid.org/0009-0006-2638-0795)
Institutions
- Nanyang Technological University (SG)
- Cornell University (US)
- Columbia University (US)
Publication Details
- Published
- 2025-05-25
- DOI
- https://doi.org/10.1109/iscas56072.2025.11043946
- Citations
- 3
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 2.19