On-Chip I/O ESD Protection for GaN-on-SOI Integrated Circuits
Gallium Nitride (GaN) platforms are reshaping the efficiency, frequency, and form factor of power electronics integrated circuits. However, the absence of p-channel transistors of GaN technologies makes traditional electrostatic discharge (ESD) protection for integrated circuits (ICs) ineffective. This letter proposes a protection network for input/output pins that leverages the unique conduction properties of enhancement-mode GaN transistors in the third quadrant of their current-voltage (I-V) plane. Experimental measurements confirm the viability of the proposed solution as a library element of the process design kit.
Authors
- Salvatore Pennisi (ORCID: https://orcid.org/0000-0002-5803-484X)
- Katia Samperi (ORCID: https://orcid.org/0000-0002-6009-7815)
- Urmimala Chatterjee (ORCID: https://orcid.org/0000-0002-8934-6774)
Institutions
- University of Catania (IT)
- IMEC (BE)
Publication Details
- Published
- 2025-05-25
- DOI
- https://doi.org/10.1109/iscas56072.2025.11044165
- Primary Topic
- Electrostatic Discharge in Electronics
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- European Commission