Oxho-3D: An Analytical Die-to-Die 3D Placement Engine

In this paper, a placement algorithm is proposed for die-to-die optimization in three-dimensional space. To address the challenges of hybrid bonding overhead and wirelength optimization, our method employs a 3D global placement strategy to explore the full solution space efficiently. The algorithm not only optimizes wirelength but also significantly reduces the usage of hybrid bonding terminals. Compared to the top three winners of the ICCAD’22 CAD competition, experimental results show that our method achieves the best normalized average wirelength and reduces hybrid bonding terminal usage to approximately 28.8% of that of the top 1 winner.