Coating Thickness in Hot Dip Tinning of Copper Wire by POIn-52 Solder
Hot dip tinning of copper wire by POIn-52 solder is considered. A regression model of the coating thickness as a function of the linear velocity and the melt temperature is proposed. The dependence of the coating thickness on the tinning conditions is derived. Optimal conditions of coating application are identified.
Authors
- M. V. Kuzmin (ORCID: https://orcid.org/0000-0003-3880-9510)
- V.L. Semenov (ORCID: https://orcid.org/0000-0002-9869-6602)
- A. O. Pat’yanova
- E. A. Mikishanina
Institutions
- Chuvash State University (RU)
Publication Details
- Journal
- Russian Engineering Research
- Published
- 2025-04-01
- DOI
- https://doi.org/10.3103/s1068798x25700649
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00