Origin of the Optimization of Photocatalytic Activities for Titanium Oxide Film Modified by an Oxidized Copper Layer

In this study, the surface photocatalytic activity of an anatase-titanium oxide (TiO<sub>x</sub>) film was modified by a thin copper (Cu) layer with the subsequential oxidation annealing process. Through this simple annealing process, the photocatalytic activity of the TiO<sub>x</sub>/Cu structure to decompose the methylene blue solution and inhibit the growth of <i>Escherichia coli</i>. could be optimized. With the help of a study on the conductive type required for the oxidation of a single Cu layer, an <i>n/p</i> nanocomposite heterojunction was realized, as this contact system anneals at temperatures of 350 °C and 450 °C. An extra electrical field at the contact interfaces that was be beneficial for separating the photo-generated electron-hole pairs (EHPs) under UV light irradiation was built. The built-in electrical field led to an increase in the structural photocatalytic activity. Moreover, as the <i>p</i>-type cuprous oxide (<i>p</i>-Cu<sub>2</sub>O) structure oxidized by the annealed Cu layer could provide a high conduction band that is offset when in contact with the TiO<sub>x</sub> film, the photogenerated EHPs on the TiO<sub>x</sub> surface could be separated more effectively. Accordingly, the 350 °C-annealed sample, abundant in the nanocomposite TiO<sub>x</sub>/Cu<sub>2</sub>O heterojunction which could significantly retard the recombination of photo-generated carriers, corresponded to an increase of about 38% in the photocatalytic activity as compared with the single TiO<sub>x</sub> film.

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Publication Details

Journal
Materials
Published
2025-06-24
DOI
https://doi.org/10.3390/ma18132993
Citations
1
Primary Topic
Copper-based nanomaterials and applications
Type
article
Field-Weighted Citation Impact
0.52

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article

Origin of the Optimization of Photocatalytic Activities for Titanium Oxide Film Modified by an Oxidized Copper Layer

Day-Shan Liu, Su‐Yi Tsai, Yi-You Hong, Pin-Jyun Shih et al.
1 citations
Materials
Copper-based nanomaterials and applications
0.52
article

Origin of the Optimization of Photocatalytic Activities for Titanium Oxide Film Modified by an Oxidized Copper Layer

Day-Shan Liu, Su‐Yi Tsai, Yi-You Hong, Pin-Jyun Shih, Jian‐An Chen
article en
1 citations

Abstract

In this study, the surface photocatalytic activity of an anatase-titanium oxide (TiO<sub>x</sub>) film was modified by a thin copper (Cu) layer with the subsequential oxidation annealing process. Through this simple annealing process, the photocatalytic activity of the TiO<sub>x</sub>/Cu structure to decompose the methylene blue solution and inhibit the growth of <i>Escherichia coli</i>. could be optimized. With the help of a study on the conductive type required for the oxidation of a single Cu layer, an <i>n/p</i> nanocomposite heterojunction was realized, as this contact system anneals at temperatures of 350 °C and 450 °C. An extra electrical field at the contact interfaces that was be beneficial for separating the photo-generated electron-hole pairs (EHPs) under UV light irradiation was built. The built-in electrical field led to an increase in the structural photocatalytic activity. Moreover, as the <i>p</i>-type cuprous oxide (<i>p</i>-Cu<sub>2</sub>O) structure oxidized by the annealed Cu layer could provide a high conduction band that is offset when in contact with the TiO<sub>x</sub> film, the photogenerated EHPs on the TiO<sub>x</sub> surface could be separated more effectively. Accordingly, the 350 °C-annealed sample, abundant in the nanocomposite TiO<sub>x</sub>/Cu<sub>2</sub>O heterojunction which could significantly retard the recombination of photo-generated carriers, corresponded to an increase of about 38% in the photocatalytic activity as compared with the single TiO<sub>x</sub> film.

MaterialsVol. 18(13)
National Formosa University (TW)
Industrial Technology Research Institute, Metals Industry Research and Development Center
Clean water and sanitation
Openalex Percentile: Top 37%
Copper-based nanomaterials and applications
0.52
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