2T1M and Complementary 3T2M Type-XY SOT-MRAM With High Performance and High Density

Type-XY SOT-MRAM is promising to achieve smaller footprint compared to the type-Y cells, and to circumvent the non-deterministic characteristic suffered by the type-X switching. This work verifies the high performance of type-XY switching in a 2-transistor-1-memory (2T1M) array, showing the capability of low write-error-rate (<0.1%) and low switching current density under high writing speed (~69.6 MA/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>@1ns). Combining these advantages with the polarity-controllable characteristics, a novel complementary type-XY device is demonstrated in 3-transistor-2-memory (3T2M) configuration by sharing the SOT line. This 3T2M device is capable of fast and efficient one-pulse complementary switching (1V@10ns), high endurance (8×10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sup>cycles@±0.8V/100ns) with low write error rate (<0.1%@1V/500ns). In the advanced CMOS technology nodes, using type-XY cells is projected to outperform the traditional solution using type-Y cells: 0.61× cell size with 0.41× write power in traditional 2T1M, 0.67× cell size with 0.10× operation power in 3T2M for complementary write function. Considering the sharable processes between 2T1M and 3T2M, using type-XY cells can be a fabrication-friendly solution to facilitate the integration of multifunctional memories in the advanced chips.

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Journal
IEEE Electron Device Letters
Published
2025-06-24
DOI
https://doi.org/10.1109/led.2025.3582797
Primary Topic
Ferroelectric and Negative Capacitance Devices
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article
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article

2T1M and Complementary 3T2M Type-XY SOT-MRAM With High Performance and High Density

Shao‐Yu Yang, I. J. Wang, G. L. Chen, Sih-Han Li et al.
1 links
IEEE Electron Device Letters
Ferroelectric and Negative Capacitance Devices
article

2T1M and Complementary 3T2M Type-XY SOT-MRAM With High Performance and High Density

Shao‐Yu Yang, I. J. Wang, G. L. Chen, Sih-Han Li, K. M. Chen, K. T. Chang, Xinyu Bao, Chenyu Hu, M. Y. Song, J. H. Wei, Yu-Chen Hsin, T. Y. Lee
article en

Abstract

Type-XY SOT-MRAM is promising to achieve smaller footprint compared to the type-Y cells, and to circumvent the non-deterministic characteristic suffered by the type-X switching. This work verifies the high performance of type-XY switching in a 2-transistor-1-memory (2T1M) array, showing the capability of low write-error-rate (<0.1%) and low switching current density under high writing speed (~69.6 MA/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>@1ns). Combining these advantages with the polarity-controllable characteristics, a novel complementary type-XY device is demonstrated in 3-transistor-2-memory (3T2M) configuration by sharing the SOT line. This 3T2M device is capable of fast and efficient one-pulse complementary switching (1V@10ns), high endurance (8×10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sup>cycles@±0.8V/100ns) with low write error rate (<0.1%@1V/500ns). In the advanced CMOS technology nodes, using type-XY cells is projected to outperform the traditional solution using type-Y cells: 0.61× cell size with 0.41× write power in traditional 2T1M, 0.67× cell size with 0.10× operation power in 3T2M for complementary write function. Considering the sharable processes between 2T1M and 3T2M, using type-XY cells can be a fabrication-friendly solution to facilitate the integration of multifunctional memories in the advanced chips.

IEEE Electron Device LettersVol. 46(8)
Taiwan Semiconductor Manufacturing Company (United States) (US), Taiwan Semiconductor Manufacturing Company (Taiwan) (TW), Industrial Technology Research Institute (TW)
Openalex Percentile: Top 87%
Ferroelectric and Negative Capacitance Devices
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