Comparison of CT Imaging Methods for Defect Detection in a Multi-Material 7-Pin Power Connector

This paper explores industrial computed tomography (CT) for detection of anomalies such as voids and gaps in power connectors for automotive application. Such defects can lead to leakage paths which can cause electrical malfunction or short circuits. A primary challenge in CT analysis arises from the proximity of dense metal parts next to plastic material, which induces strong imaging artifacts that hinder the evaluation of such defects. This study evaluates three imaging methods - standard Filtered Back Projection reconstruction (FBP), Quantum Reconstruction Technique (QRT), and dual-energy combination (DE) - to mitigate these artifacts and improve defect visualization. Each method's efficacy is assessed by analyzing the accuracy in detecting and characterizing gaps and voids. Results are compared to a target preparation and cross-section analysis with optical microscopy, providing a benchmark for reliability and accuracy. Full experimental findings and comparisons are detailed in the complete paper.

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Publication Details

Journal
e-Journal of Nondestructive Testing
Published
2025-06-24
DOI
https://doi.org/10.58286/31459
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
Field-Weighted Citation Impact
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article

Comparison of CT Imaging Methods for Defect Detection in a Multi-Material 7-Pin Power Connector

C. Woelk, Darius Rückert, Thomas Riedel, André Döring et al.
e-Journal of Nondestructive Testing
Integrated Circuits and Semiconductor Failure Analysis
article

Comparison of CT Imaging Methods for Defect Detection in a Multi-Material 7-Pin Power Connector

C. Woelk, Darius Rückert, Thomas Riedel, André Döring, Jochen Butzer, Uta Proettel, Philipp Kurth, Fabian Rückert
article en

Abstract

This paper explores industrial computed tomography (CT) for detection of anomalies such as voids and gaps in power connectors for automotive application. Such defects can lead to leakage paths which can cause electrical malfunction or short circuits. A primary challenge in CT analysis arises from the proximity of dense metal parts next to plastic material, which induces strong imaging artifacts that hinder the evaluation of such defects. This study evaluates three imaging methods - standard Filtered Back Projection reconstruction (FBP), Quantum Reconstruction Technique (QRT), and dual-energy combination (DE) - to mitigate these artifacts and improve defect visualization. Each method's efficacy is assessed by analyzing the accuracy in detecting and characterizing gaps and voids. Results are compared to a target preparation and cross-section analysis with optical microscopy, providing a benchmark for reliability and accuracy. Full experimental findings and comparisons are detailed in the complete paper.

e-Journal of Nondestructive TestingVol. 30(8)
Openalex Percentile: Top 87%
Integrated Circuits and Semiconductor Failure Analysis
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