Design and Optimization of SMT Reflow Soldering Curves Driven by Digital Twins

The surface mount technology (SMT) reflow soldering process for electronic modules with ‘multi-variety, small-batch, variable states' faces significant challenges in achieving agility, low cost, and high quality. Traditional physical validation methods, such as using thermocouple test boards, are costly and time-consuming, making it difficult to meet the high agility requirements and rapid quality convergence needed for simultaneous development, deployment, and improvement. There is an inherent need for production lines to achieve ‘self-detection, self-diagnosis, self-optimization, and self-correction’ through intelligent manufacturing. Through the establishment of reflow soldering digital twin model, and reflow soldering ‘physical entity’ to establish sensing and control interaction, to achieve ‘data perception – real – time analysis – intelligent decision-making – accurate implementation’ of real-time intelligent closed loop. Through multi-scenario comparison test on physical test data and twin data, the result has good consistency, high repeatability, and the expenditure of time and funds is greatly reduced. Experimental results show that the reflow soldering digital twin can realize the design and optimization of reflow soldering curves, and real-time monitoring and adjustment of process parameters.