Design and Optimization for Hybrid interconnection of Signal and Power supply in FPCB

This article proposes a general electrical interconnect structure based on a 4-layer flexible circuit to meet the interconnection requirements of signals and power in highdensity electronic systems. The basic characteristic of this flexibility is to set the top and bottom layers as geological layers, and divide the middle two layers into signal layer and power layer. The routing of adjacent signal transmission lines and power transmission lines is arranged in a staggered distribution, which can effectively reduce the routing space and improve the effective routing density compared to traditional strip line or microstrip line circuits. For the issues of signal integrity and power transmission, this article takes the universal interconnect structure as the research object. Based on orthogonal experiments and variance analysis, factors that have a significant impact on the above problems are selected. The response surface method is used to obtain the functional equation between the influencing factors and crosstalk. The impact of relevant factors on crosstalk is qualitatively analyzed, and the response surface model is optimized according to design requirements to obtain a reasonable wire structure design and layout to ensure excellent electrical performance of the circuit.