Analytical method for determining the temperature dependence of the thermal conductivity coefficient

The paper developed an analytical method for determining the temperature dependence of the thermal conductivity coefficient, which is based on the approximation of the temperature field obtained using an infrared thermal imaging camera by the solution of the inhomogeneous stationary equation of thermal conductivity. From the obtained experimental dependences, it is shown that the proposed method based on the stationary heat flux can be used to determine the temperature dependence of the thermal conductivity coefficient for solids: metals, multicomponent alloys, semiconductors and dielectrics. The temperature dependences of the thermal conductivity of test samples of fluoroplastic and steel were obtained. According to these experimental results, the thermal conductivity of fluoroplastic increases, and the thermal conductivity of steel decreases with increasing temperature.