Analyzing Resonance-Induced Rate Offsets Over Temperature in MEMS Gyroscopes Due to Die Fixation

In this work, we introduce an analytical model for a coupling effect due to packaging. It describes the rate-offset induced on MEMS gyroscope devices by the proximity between one mode of the MEMS die fixation and the MEMS working frequency. Our focus is to study the rate-offset caused by the MEMS fixation over temperature. We present a model that captures qualitatively the behavior of a MEMS gyroscope when one of the modes of the die fixation approaches the MEMS operating frequency due to temperature effects. Three mode-coupled sensors with different die fixation characteristics were measured. The model was compared to the experiments, showing that the model can qualitatively capture the behavior of the three measured sensors.