Self-Bonding Piezoelectric Micromirrors for Integrated Atomic Beam Devices

We introduce a 45° tilted MEMS mirror for chip-scale atomic devices. The voltage-actuated-and-bonded mirror shows outstanding reflectivity and is a crucial component for laser cooling or interrogation of atomic beam devices, facilitating advancements in wafer-level manufacturing of integrated quantum sensors. By integrating two of these micromirrors with a collimator, excitation source and a detector, an atomic beam clock can be achieved, whose fractional instability could be in the order of ~10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−11</sup> at 1s with a chip-scale package.

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Published
2025-05-04
DOI
https://doi.org/10.1109/inertial63280.2025.11036993
Primary Topic
Advanced MEMS and NEMS Technologies
Type
article
Field-Weighted Citation Impact
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article

Self-Bonding Piezoelectric Micromirrors for Integrated Atomic Beam Devices

Ce Pei, Chandra Raman, Farrokh Ayazi, Jiacheng Wang
3 links
Advanced MEMS and NEMS Technologies
article

Self-Bonding Piezoelectric Micromirrors for Integrated Atomic Beam Devices

Ce Pei, Chandra Raman, Farrokh Ayazi, Jiacheng Wang
article en

Abstract

We introduce a 45° tilted MEMS mirror for chip-scale atomic devices. The voltage-actuated-and-bonded mirror shows outstanding reflectivity and is a crucial component for laser cooling or interrogation of atomic beam devices, facilitating advancements in wafer-level manufacturing of integrated quantum sensors. By integrating two of these micromirrors with a collimator, excitation source and a detector, an atomic beam clock can be achieved, whose fractional instability could be in the order of ~10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−11</sup> at 1s with a chip-scale package.

Georgia Institute of Technology (US)
National Science Foundation
Affordable and clean energy
Openalex Percentile: Top 88%
Advanced MEMS and NEMS Technologies
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