Measuring Angular Rate and Substrate Stress from the Same Sensing Piezoresistors: A Path Towards Compensating Drift Induced by Package Deformation?

This work introduces a novel method to monitor substrate deformations in micro-machined gyroscopes by using the same piezoresistive sensing elements to measure both the angular rate information, modulated around the drive frequency, and the low-frequency substrate-induced stress. By exploiting the dual functionality of the strain gauges within a single sensor die, this approach aims to provide a path towards realtime drift compensation without the need for dedicated stressmonitoring structures. Preliminary tests conducted on a dual-board setup-where the gyroscope carrier and electronics are mounted separately-on non-operative gyroscopes demonstrate that induced stresses can be detected, discriminated from temperature effects, and differentiated based on the load direction. The results highlight the potential of integrating stress monitoring into conventional gyroscope systems to improve long-term stability, paving the way for future integrated, real-time compensation solutions.