Silicon Oxycarbide Thin Films Produced by Hydrogen-Induced CVD Process from Cyclic Dioxa-Tetrasilacyclohexane

Silicon oxycarbide coatings are the subject of research due to their exceptional optical, electronic, anti-corrosion, etc., properties, which make them attractive for a number of applications. In this article, we present a study on the synthesis and characterization of thin SiOC:H silicon oxycarbide films with the given composition and properties from a new organosilicon precursor octamethyl-1,4-dioxatetrasilacyclohexane (<sup>2</sup>D<sub>2</sub>) and its macromolecular equivalent-poly(oxybisdimethylsily1ene) (POBDMS). Layers from <sup>2</sup>D<sub>2</sub> precursor with different SiOC:H structure, from polymeric to ceramic-like, were produced in the remote microwave hydrogen plasma by CVD method (RHP-CVD) on a heated substrate in the temperature range of 30-400 °C. SiOC:H polymer layers from POEDMS were deposited from solution by spin coating and then crosslinked in RHP via the breaking of the Si-Si silyl bonds initiated by hydrogen radicals. The properties of SiOC:H layers obtained by both methods were compared. The density of the cross-linked materials was determined by the gravimetric method, elemental composition by means of XPS, chemical structure by FTIR spectroscopy, and NMR spectroscopy (<sup>13</sup>C, <sup>29</sup>Si). Photoluminescence analyses and ellipsometric measurements were also performed. Surface morphology was characterized by AFM. Based on the obtained results, a mechanism of initiation, growth, and cross-linking of the CVD layers under the influence of hydrogen radicals was proposed.

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Journal
Materials
Published
2025-06-19
DOI
https://doi.org/10.3390/ma18122911
Citations
3
Primary Topic
Semiconductor materials and devices
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article
Field-Weighted Citation Impact
2.19
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article

Silicon Oxycarbide Thin Films Produced by Hydrogen-Induced CVD Process from Cyclic Dioxa-Tetrasilacyclohexane

Krzysztof Jankowski, Paweł Uznański, A. Walkiewicz‐Pietrzykowska, Joanna Zakrzewska et al.
3 citations
Materials
Semiconductor materials and devices
2.19
article

Silicon Oxycarbide Thin Films Produced by Hydrogen-Induced CVD Process from Cyclic Dioxa-Tetrasilacyclohexane

Krzysztof Jankowski, Paweł Uznański, A. Walkiewicz‐Pietrzykowska, Joanna Zakrzewska, Jan Kurjata, Rafał Dolot, R. Brzozowski
article en
3 citations

Abstract

Silicon oxycarbide coatings are the subject of research due to their exceptional optical, electronic, anti-corrosion, etc., properties, which make them attractive for a number of applications. In this article, we present a study on the synthesis and characterization of thin SiOC:H silicon oxycarbide films with the given composition and properties from a new organosilicon precursor octamethyl-1,4-dioxatetrasilacyclohexane (<sup>2</sup>D<sub>2</sub>) and its macromolecular equivalent-poly(oxybisdimethylsily1ene) (POBDMS). Layers from <sup>2</sup>D<sub>2</sub> precursor with different SiOC:H structure, from polymeric to ceramic-like, were produced in the remote microwave hydrogen plasma by CVD method (RHP-CVD) on a heated substrate in the temperature range of 30-400 °C. SiOC:H polymer layers from POEDMS were deposited from solution by spin coating and then crosslinked in RHP via the breaking of the Si-Si silyl bonds initiated by hydrogen radicals. The properties of SiOC:H layers obtained by both methods were compared. The density of the cross-linked materials was determined by the gravimetric method, elemental composition by means of XPS, chemical structure by FTIR spectroscopy, and NMR spectroscopy (<sup>13</sup>C, <sup>29</sup>Si). Photoluminescence analyses and ellipsometric measurements were also performed. Surface morphology was characterized by AFM. Based on the obtained results, a mechanism of initiation, growth, and cross-linking of the CVD layers under the influence of hydrogen radicals was proposed.

MaterialsVol. 18(12)
The Jacob of Paradies University (PL), Centrum Badań Molekularnych i Makromolekularnych Polskiej Akademii Nauk (PL), Polish Academy of Sciences (PL)
Openalex Percentile: Top 12%
Semiconductor materials and devices
2.19
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