Numerical Simulation on Heat Dissipation Characteristics of Electronic Components with Different Heat Sink Arrangements in High-Performance Server

As the integration of electronic components in high-performance servers increases, heat generation significantly impacts performance and raises failure rates. Therefore, heat dissipation has become a critical concern in electronic circuit design. This study uses numerical simulations to investigate the heat dissipation characteristics of electronic components in air-cooled servers. By adjusting airflow speed, heat sink configurations, and the arrangement of straight-fin heat sinks, we optimize heat dissipation performance and analyze the mechanisms at different airflow speeds. The results show that, at the same airflow speed, the temperature of the heat sink is lower than that of the electronic components, creating a temperature gradient that enhances heat transfer. Compared to a front-to-back arrangement of two straight-fin heat sinks, placing the heat sinks parallel to each other results in a lower maximum component temperature and better temperature uniformity. Heat sinks with fins significantly improve heat dissipation. The heat sink with semicylindrical fins on the rib surface provides the best cooling performance. Moreover, compared to natural convection, the maximum temperature of the electronic components decreases by 56.17% and 61% when the incoming flow velocity is 6 m/s with two parallel flat ribbed heat sinks and front-to-back arrangement, respectively.