A non-invasive dry-transfer method for fabricating mesoscopic devices on sensitive materials

Many materials with novel or exotic properties are highly sensitive to environmental factors such as air, solvents, and heat, which complicate device fabrication and limit their potential applications. Here, we present a universal sub-micrometer fabrication method for mesoscopic devices using a dry-transfer technique, tailored specifically for sensitive materials. This approach utilizes PMMA masks, combined with a water-dissoluble coating as a sacrificial layer, to ensure that sensitive materials are processed without exposure to harmful environmental conditions. The entire fabrication process is carried out in a glovebox, employing dry techniques that avoid air, solvents, and heat exposure, culminating in an encapsulation step. We demonstrate the utility of this method by fabricating and characterizing K2Cr3As3 and WTe2 devices, a one- and two-dimensional material, respectively. The results show that our technique preserves the integrity of the materials, provides excellent contact interfaces, and is broadly applicable to a range of sensitive materials.

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Publication Details

Journal
Applied Physics Letters
Published
2025-06-16
DOI
https://doi.org/10.1063/5.0263946
Primary Topic
2D Materials and Applications
Type
article
Field-Weighted Citation Impact
0.00

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article

A non-invasive dry-transfer method for fabricating mesoscopic devices on sensitive materials

Jiangping Hu, Bingbing Tong, Jianfei Xiao, Ziwei Dou et al.
Applied Physics Letters
2D Materials and Applications
article

A non-invasive dry-transfer method for fabricating mesoscopic devices on sensitive materials

Jiangping Hu, Bingbing Tong, Jianfei Xiao, Ziwei Dou, Jiezhong He, Guangtong Liu, Fanming Qu, Xiaohui Song, D. Y. Wang, Zhongchen Xu, Zhaozheng Lyu, Yunteng Shi, Zhongmou Jia, Jie Shen, Zhiyuan Zhang, Peiling Li, Youguo Shi, Xue Yang, Li Lü, Yunyun Ma, Sicheng Zhou
article en

Abstract

Many materials with novel or exotic properties are highly sensitive to environmental factors such as air, solvents, and heat, which complicate device fabrication and limit their potential applications. Here, we present a universal sub-micrometer fabrication method for mesoscopic devices using a dry-transfer technique, tailored specifically for sensitive materials. This approach utilizes PMMA masks, combined with a water-dissoluble coating as a sacrificial layer, to ensure that sensitive materials are processed without exposure to harmful environmental conditions. The entire fabrication process is carried out in a glovebox, employing dry techniques that avoid air, solvents, and heat exposure, culminating in an encapsulation step. We demonstrate the utility of this method by fabricating and characterizing K2Cr3As3 and WTe2 devices, a one- and two-dimensional material, respectively. The results show that our technique preserves the integrity of the materials, provides excellent contact interfaces, and is broadly applicable to a range of sensitive materials.

Applied Physics LettersVol. 126(24)
Chinese Academy of Sciences (CN), Hefei University (CN), Songshan Lake Materials Laboratory (CN), FZU ‒ Institute of Physics of the Academy of Sciences of the Czech Republic (CZ), University of Chinese Academy of Sciences (CN)
National Natural Science Foundation of China, National Key Research and Development Program of China
Openalex Percentile: Top 90%
2D Materials and Applications
DOIOpen Access PDFOpenAlex
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