Enhancing Program Speed and Diminishing Read After Write Delay by Metal Work Function Engineering

We investigate the impact of gate metal work function (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub>) engineering on the performance of Metal - Interlayer – Ferroelectric (FE) – Interlayer – Silicon (MIFIS) ferroelectric field effect transistors (FeFET). The gate injected trapped charge (Q<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">it</sub>’) plays a critical role in determining key device parameters such as the memory window (MW) and operating voltage (V<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">op</sub>), making Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> optimization a viable approach to enhance MIFIS FeFET performance. To evaluate this effect, we fabricated devices with Al (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> = 4.1 eV), TiN (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> = 4.7 eV), Pt (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> = 5.35 eV) gate metals. A higher Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> reduces the valence band offset at the gate interlayer (G.IL), facilitating hole injection during program (PGM) operations. This results in a lower PGM V<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">op</sub> and a steeper incremental step pulse programming (ISPP) profile. Simulation results confirm that enhanced gate hole injection underpins the observed ISPP behavior. Additionally, high Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> gates reduce read after write delay (RAWD) and lower de-trap pulse amplitudes. Our findings establish gate Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> engineering as an effective strategy to improve MIFIS FeFET performance, particularly for low-voltage operation and disturbance mitigation.

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Journal
IEEE Electron Device Letters
Published
2025-06-18
DOI
https://doi.org/10.1109/led.2025.3580827
Citations
1
Primary Topic
Ferroelectric and Negative Capacitance Devices
Type
article
Field-Weighted Citation Impact
0.73

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article

Enhancing Program Speed and Diminishing Read After Write Delay by Metal Work Function Engineering

S.S. Park, Jinho Ahn, Daewon Ha, Giuk Kim et al.
1 citations
IEEE Electron Device Letters
Ferroelectric and Negative Capacitance Devices
0.73
article

Enhancing Program Speed and Diminishing Read After Write Delay by Metal Work Function Engineering

S.S. Park, Jinho Ahn, Daewon Ha, Giuk Kim, Sanghun Jeon, Wanki Kim, Kwangsoo Kim, Hyojun Choi, Kwangyou Seo, Seokjoong Shin
article en
1 citations

Abstract

We investigate the impact of gate metal work function (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub>) engineering on the performance of Metal - Interlayer – Ferroelectric (FE) – Interlayer – Silicon (MIFIS) ferroelectric field effect transistors (FeFET). The gate injected trapped charge (Q<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">it</sub>’) plays a critical role in determining key device parameters such as the memory window (MW) and operating voltage (V<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">op</sub>), making Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> optimization a viable approach to enhance MIFIS FeFET performance. To evaluate this effect, we fabricated devices with Al (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> = 4.1 eV), TiN (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> = 4.7 eV), Pt (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> = 5.35 eV) gate metals. A higher Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> reduces the valence band offset at the gate interlayer (G.IL), facilitating hole injection during program (PGM) operations. This results in a lower PGM V<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">op</sub> and a steeper incremental step pulse programming (ISPP) profile. Simulation results confirm that enhanced gate hole injection underpins the observed ISPP behavior. Additionally, high Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> gates reduce read after write delay (RAWD) and lower de-trap pulse amplitudes. Our findings establish gate Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> engineering as an effective strategy to improve MIFIS FeFET performance, particularly for low-voltage operation and disturbance mitigation.

IEEE Electron Device LettersVol. 46(8)
Korea Advanced Institute of Science and Technology (KR), Samsung (South Korea) (KR), Hanyang University (KR)
Ministry of Trade, Industry and Energy, Samsung
Openalex Percentile: Top 27%
Ferroelectric and Negative Capacitance Devices
0.73
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