Enhancing Program Speed and Diminishing Read After Write Delay by Metal Work Function Engineering
We investigate the impact of gate metal work function (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub>) engineering on the performance of Metal - Interlayer – Ferroelectric (FE) – Interlayer – Silicon (MIFIS) ferroelectric field effect transistors (FeFET). The gate injected trapped charge (Q<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">it</sub>’) plays a critical role in determining key device parameters such as the memory window (MW) and operating voltage (V<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">op</sub>), making Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> optimization a viable approach to enhance MIFIS FeFET performance. To evaluate this effect, we fabricated devices with Al (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> = 4.1 eV), TiN (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> = 4.7 eV), Pt (Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> = 5.35 eV) gate metals. A higher Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> reduces the valence band offset at the gate interlayer (G.IL), facilitating hole injection during program (PGM) operations. This results in a lower PGM V<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">op</sub> and a steeper incremental step pulse programming (ISPP) profile. Simulation results confirm that enhanced gate hole injection underpins the observed ISPP behavior. Additionally, high Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> gates reduce read after write delay (RAWD) and lower de-trap pulse amplitudes. Our findings establish gate Ф<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">M</sub> engineering as an effective strategy to improve MIFIS FeFET performance, particularly for low-voltage operation and disturbance mitigation.
Authors
- S.S. Park (ORCID: https://orcid.org/0000-0002-3174-5043)
- Jinho Ahn (ORCID: https://orcid.org/0000-0001-8271-5998)
- Daewon Ha (ORCID: https://orcid.org/0000-0002-9061-8626)
- Giuk Kim
- Sanghun Jeon (ORCID: https://orcid.org/0000-0002-4222-1587)
- Wanki Kim
- Kwangsoo Kim (ORCID: https://orcid.org/0009-0002-7216-7099)
- Hyojun Choi
- Kwangyou Seo
- Seokjoong Shin
Institutions
- Korea Advanced Institute of Science and Technology (KR)
- Samsung (South Korea) (KR)
- Hanyang University (KR)
Publication Details
- Journal
- IEEE Electron Device Letters
- Published
- 2025-06-18
- DOI
- https://doi.org/10.1109/led.2025.3580827
- Citations
- 1
- Primary Topic
- Ferroelectric and Negative Capacitance Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.73
Funders
- Ministry of Trade, Industry and Energy
- Samsung