Ka-Band GaN HEMT With Segmented Discrete Field Plate

An innovative segmented discrete field plate (SDFP) was applied in the Ka-band GaN high-electron-mobility transistor (HEMT). The device was located at the top and bottom of gate area but disconnected from any electrode. The new device with SDFP got an <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small>-state breakdown voltage of 131 V, while the breakdown voltage of ordinary T-gate devices was 98 V with source-drain spacing at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2.4~\mu $</tex-math> </inline-formula>m. In addition, the method also achieved an order of magnitude lower <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small>-state leakage current and good suppression of current collapse than the T-gate device. In particular, a device of SDFP achieved an output power of 6.08 W/mm, a gain of 9.6 dB, and a power added efficiency of more than 33%. This technique held the potential for application in Ka-band high opreating voltage GaN HEMTs.

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Publication Details

Journal
IEEE Microwave and Wireless Technology Letters
Published
2025-06-18
DOI
https://doi.org/10.1109/lmwt.2025.3578072
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.00

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article

Ka-Band GaN HEMT With Segmented Discrete Field Plate

Xinyu Liu, Jiaqi Guo, Xiaoqiang He, Ruizhe Zhang et al.
IEEE Microwave and Wireless Technology Letters
GaN-based semiconductor devices and materials
article

Ka-Band GaN HEMT With Segmented Discrete Field Plate

Xinyu Liu, Jiaqi Guo, Xiaoqiang He, Ruizhe Zhang, Yankui Li, Sheng Zhang, Ailing Zhou, Yichuan Zhang, Wei Ke, Jiebin Niu, Kaiyu Wang, Jianchao Wang
article en

Abstract

An innovative segmented discrete field plate (SDFP) was applied in the Ka-band GaN high-electron-mobility transistor (HEMT). The device was located at the top and bottom of gate area but disconnected from any electrode. The new device with SDFP got an <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small>-state breakdown voltage of 131 V, while the breakdown voltage of ordinary T-gate devices was 98 V with source-drain spacing at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2.4~\mu $</tex-math> </inline-formula>m. In addition, the method also achieved an order of magnitude lower <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small>-state leakage current and good suppression of current collapse than the T-gate device. In particular, a device of SDFP achieved an output power of 6.08 W/mm, a gain of 9.6 dB, and a power added efficiency of more than 33%. This technique held the potential for application in Ka-band high opreating voltage GaN HEMTs.

IEEE Microwave and Wireless Technology LettersVol. 35(9)
Chinese Academy of Sciences (CN), Institute of Microelectronics (CN)
National Natural Science Foundation of China
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GaN-based semiconductor devices and materials
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