MODELING THE STUDY OF SOLID MATERIALS' THERMAL CONDUCTIVITY USING THE DYNAMIC CALORIMETRY METHOD

Statement of the Problem.The search for energy-efficient solutions is relevant at the current construction and civil engineering development stage. One of the key parameters to be determined is the thermal conductivity of materials and products. This parameter depends on temperature and other factors, necessitating the need for fast and reliable methods to determine it for energy efficiency assessments or research purposes. One such method is using the modeling. This paper describes the formulation of modeling tasks and presents a computer model based on a real device for measuring thermal conductivity via the dynamic calorimetry method. The mathematical foundation of the model is based on Fourier’s law, thermal parameter dependencies documented in the device specifications, and data obtained from benchmark experiments. The model is implemented in the LabVIEW environment and has been tested through experiments in various operational modes. The results demonstrate a significant reduction in time required to obtain data compared to studies conducted using the physical device, highlighting the effectiveness of modeling for research purposes. The purpose of the article. To present the problem formulation and modeling results for studying the thermal conductivity of solid materials. Conclusion. The modeling tasks have been formulated, and a computer model has been developed to study the thermal conductivity of solid materials. The model simulates the processes occurring in a real thermal conductivity measurement device. Experimental studies on the actual instrument have been used to validate the model’s accuracy. The developed model can be utilized both for educational purposes and for obtaining data on the thermal conductivity and thermal insulation properties of various solid materials.