Insights into the role of Basic Blue 7 as a leveler in copper superfilling within microvias
Authors
- Ruopeng Li
- Changsheng Cao (ORCID: https://orcid.org/0000-0002-6886-3406)
- Youzheng Wu
- Xuesong Peng (ORCID: https://orcid.org/0000-0001-8584-9772)
- Yaqiang Li (ORCID: https://orcid.org/0000-0001-6269-0607)
- Fan Meng
- Penghui Ren (ORCID: https://orcid.org/0000-0001-5817-3199)
- Jie Jiang (ORCID: https://orcid.org/0000-0001-9182-335X)
- Guangzhao Wang (ORCID: https://orcid.org/0000-0002-7469-0767)
- Maozhong An (ORCID: https://orcid.org/0009-0001-9322-5879)
- Hao Xu (ORCID: https://orcid.org/0009-0005-6950-6020)
Institutions
- Yantai University (CN)
- Harbin Institute of Technology (CN)
- Inner Mongolia University (CN)
- Yangtze Normal University (CN)
- Fuzhou University (CN)
Publication Details
- Journal
- New Journal of Chemistry
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5nj02092a
- Citations
- 1
- Primary Topic
- Electrodeposition and Electroless Coatings
- Type
- article
- Field-Weighted Citation Impact
- 0.73
Funders
- National Natural Science Foundation of China
- Natural Science Foundation of Shandong Province
- Inner Mongolia University of Technology