Morphology, Thermal Properties and Rheological Behavior of Acrylate-Styrene-Acrylonitrile-Based Composites Filled with Waste Non-Metallic Printed Circuit Boards

Acrylate-styrene-acrylonitrile (ASA) was filled with waste non-metallic printed circuit boards (WNMPCB). ASA/WNMPCB composites were successfully prepared using various filler concentrations at 0, 10, 20, 30, 40 and 50 phr. Styrene-maleic anhydride (SMA) was also used as a compatibilizer to enhance the properties of ASA/WNMPCB composites. All materials were prepared using a two-roll mill at 245 °C for 15 minutes and test specimens were shaped using a compression molding machine. The effects of different WNMPCB ratios on phase morphology, rheological behavior, density, water absorption, flammability and thermal properties of ASA/WNMPCB composites were analyzed. The incorporation of WNMPCB filler into ASA matrix led to improved composite properties. It was found that an increase in WNMPCB content of up to 50 phr enhanced the density of ASA/WNMPCB composites, consistent with SEM micrographs, which demonstrated that polymer composites with WNMPCB as a filler had a rougher surface compared with neat ASA. The compatibility between the matrix (ASA) and filler (WNMPCB) improved using 3 phr of SMA as a compatibilizer. From 0 to 50 phr, the SEM-EDX images showed that the amount of Si particles increased as the WNMPCB amount increased and compatibility between the matrix and filler was maintained. Results indicated that adding WNMPCB, containing glass fiber, thermoset resin and flame retardants enhanced the rheological properties and decomposition temperature of the composites while reducing flammability.