Electron sensitivity, photosensitivity and thermoplasticity of copper-doped Ge25Se75 thin films prepared via spin-coating

• The copper-doped Ge 25 Se 75 thin films were deposited for the first time via the solution route using anhydrous copper(I) or copper(II) chloride precursors and bulk glass. • The XPS showed a reduction of Cu 2+ to Cu + oxidation form, suggesting a redox reaction in the solution phase. • Both doped and undoped thin films demonstrated positive etching selectivity, facilitating successful surface patterning. • The copper(II) chloride introduction increased the electron- and photostability of deposited thin films while copper(I) chloride increased only photostability. • The incorporation of copper significantly enhanced the thermal stability of the samples, resulting in an upward shift of the hot embossing temperature range. Copper-doped Ge 25 Se 75 thin films were deposited via spin-coating using anhydrous copper(I) or copper(II) chloride precursors to examine the effects of Cu oxidation states on film properties. The solution processing offered a cost-effective route with a mass production potential of perspective Cu-doped chalcogenide materials. The Energy-dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) techniques confirmed the Cu incorporation at its targeted concentration (5 at.%). The XPS also revealed a reduction of Cu 2+ to Cu + oxidation form, presumably already in the solution phase. Optical characterisation revealed a redshift in the bandgap due to Cu-Se bond formation while annealing at 210 °C led to partial crystallisation, forming CuGeSe x -like phases. The combination of wet etching with electron beam lithography and optical holography showed a significant increase in the stability of copper-doped material. Similarly, the thermoplasticity of copper-doped samples was affected as the hot embossing temperature dramatically shifted towards higher temperatures. However, despite having the same Cu + oxidation state, the selected copper precursor still significantly influenced the majority of studied phenomena. These findings prove that Cu doping in the solution phase modifies the optical, mechanical and potentially electrical properties of Ge 25 Se 75 thin films, making them viable for resistive memory or high-temperature photonic applications.

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Publication Details

Journal
Applied Surface Science
Published
2025-06-17
DOI
https://doi.org/10.1016/j.apsusc.2025.163848
Citations
2
Primary Topic
Phase-change materials and chalcogenides
Type
article
Field-Weighted Citation Impact
1.04
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article

Electron sensitivity, photosensitivity and thermoplasticity of copper-doped Ge25Se75 thin films prepared via spin-coating

Jiří Jančálek, Jhonatan Rodríguez‐Pereira, Michal Kurka, Jakub Houdek et al.
2 citations
Applied Surface Science
Phase-change materials and chalcogenides
1.04
article

Electron sensitivity, photosensitivity and thermoplasticity of copper-doped Ge25Se75 thin films prepared via spin-coating

Jiří Jančálek, Jhonatan Rodríguez‐Pereira, Michal Kurka, Jakub Houdek, Stanislav Šlang, Martin Veis, Miroslav Vlček, Karel Pálka, Ján Hrabovský
article en
2 citations

Abstract

• The copper-doped Ge 25 Se 75 thin films were deposited for the first time via the solution route using anhydrous copper(I) or copper(II) chloride precursors and bulk glass. • The XPS showed a reduction of Cu 2+ to Cu + oxidation form, suggesting a redox reaction in the solution phase. • Both doped and undoped thin films demonstrated positive etching selectivity, facilitating successful surface patterning. • The copper(II) chloride introduction increased the electron- and photostability of deposited thin films while copper(I) chloride increased only photostability. • The incorporation of copper significantly enhanced the thermal stability of the samples, resulting in an upward shift of the hot embossing temperature range. Copper-doped Ge 25 Se 75 thin films were deposited via spin-coating using anhydrous copper(I) or copper(II) chloride precursors to examine the effects of Cu oxidation states on film properties. The solution processing offered a cost-effective route with a mass production potential of perspective Cu-doped chalcogenide materials. The Energy-dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) techniques confirmed the Cu incorporation at its targeted concentration (5 at.%). The XPS also revealed a reduction of Cu 2+ to Cu + oxidation form, presumably already in the solution phase. Optical characterisation revealed a redshift in the bandgap due to Cu-Se bond formation while annealing at 210 °C led to partial crystallisation, forming CuGeSe x -like phases. The combination of wet etching with electron beam lithography and optical holography showed a significant increase in the stability of copper-doped material. Similarly, the thermoplasticity of copper-doped samples was affected as the hot embossing temperature dramatically shifted towards higher temperatures. However, despite having the same Cu + oxidation state, the selected copper precursor still significantly influenced the majority of studied phenomena. These findings prove that Cu doping in the solution phase modifies the optical, mechanical and potentially electrical properties of Ge 25 Se 75 thin films, making them viable for resistive memory or high-temperature photonic applications.

Applied Surface ScienceVol. 709
University of Pardubice (CZ), Charles University (CZ)
Openalex Percentile: Top 24%
Phase-change materials and chalcogenides
1.04
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