A multi-scale interface-induced 3D percolation network in polymeric heterostructures for EMI shielding application

Mechanical compounding and hot pressing were used to prepare a composite material. The material retains excellent EMI shielding capability under simulated harsh marine environments and enables highly flexible mechanical interlocking strategies.

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Publication Details

Journal
Journal of Materials Chemistry C
Published
2025-01-01
DOI
https://doi.org/10.1039/d5tc01738f
Citations
1
Primary Topic
Electromagnetic wave absorption materials
Type
article
Field-Weighted Citation Impact
0.43
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article

A multi-scale interface-induced 3D percolation network in polymeric heterostructures for EMI shielding application

Lijian Mao, Qiang Chen, Chuntai Liu, Jiahao Sun et al.
1 citations
Journal of Materials Chemistry C
Electromagnetic wave absorption materials
0.43
article

A multi-scale interface-induced 3D percolation network in polymeric heterostructures for EMI shielding application

Lijian Mao, Qiang Chen, Chuntai Liu, Jiahao Sun, Zhenliang Gao, Xianhu Liu, Lechun Deng, Changyu Shen, Li Yang
article en
1 citations

Abstract

Mechanical compounding and hot pressing were used to prepare a composite material. The material retains excellent EMI shielding capability under simulated harsh marine environments and enables highly flexible mechanical interlocking strategies.

Journal of Materials Chemistry CVol. 13(30)
Northwestern Polytechnical University (CN), Zhengzhou University (CN)
Openalex Percentile: Top 41%
Electromagnetic wave absorption materials
0.43
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