Novel Smart Mountable Cooling Pad Using Type C Silica Gel

Life without mobile phone is inevitable in this modern day of living. Mobile is a communication device which connects people from any part of the world and makes them feel that the person is right here. Mobile is a device which brings the world in the users hand. Mobile phone is an electronic device which becomes heated over a certain period of time after usage. Heating of mobile phones has various effects on the internal circuits of mobile phone. This also affects CPU, chipsets, integrated circuits, graphics card and also other various parts of the mobile. Heating of mobile phones is the main disadvantage and issue from the customer in the modern world. Many top companies have used various techniques and mechanism to overcome this issue. Many methods include air cooling method, liquid cooling method, vapour cooling method, they are inbuilt in the upcoming mobiles, but the cooling mechanism of these methods doesn’t maintain the temperature of the mobile phone within the certain permissible temperature. To overcome this issue, a design is developed which includes a semiconductor cooling technology along with 3-D printing to maintain the temperature. This method involves five layers which includes silica gel sheet, thermal sheet, semiconductor cooling pad, cooling column and a fan. All these layers are mounted in a single device which is designed using 3-D printing technology. This cooling system is portable, adjustable and mountable semiconductor cooling system. This method involves a fan of 10,000 rpm, Type-C silica gel which is a macroporous substance which helps in rapid cooling and maintaining the temperature of the mobile. Due to this methodology, the effects of heating like decreased phone performance, battery degradation, shortening of lifespan of the device, melting of integrated circuits and in worst cases this may also lead to explosion of the mobile. The usage of this 3-D printed cooling device reduces the temperature of mobile by an average of 8 F and maintain the temperature of the mobile. The average temperature of the mobile phone after using it for an hour is displayed as 112 F in the thermal gun, by using this device for a minute the average temperature of the mobile phone is reduced significantly to 96.1 F. The temperature of the mobile phone is reduced as an average of 6%. This mountable device will be evolved in the future with inbuilt cooling system or either cooling case by automatically measuring the temperature and it is charged with wireless charging mechanism.