HiePlace: Efficient Hierarchical PCB Placement
Due to the rapid expansion of printed circuit board (PCB) designs, accompanied by diverse design rules and specific constraints, there has been a substantial increase in manual design engineering efforts. To address this challenge, industries are seeking productivity improvements through automated placement techniques. However, existing placers primarily target VLSI placement and do not align well with PCBs’ unique characteristics. This mismatch arises from both the customization of PCBs and the complexity of the problem, which involves considering various constraints such as priorities, irregularities, and alignment. This paper introduces HiePlace, an efficient mathematical programming (MP)-based placement framework designed explicitly for PCBs. It aims to address the diverse constraints and achieve better performance. To address the issue of time-consuming computation in the direct MP-based algorithm, we present two innovative acceleration techniques: (1) In the initial stage, we introduce a dynamic programming approach to prioritize the placement of core components. This technique effectively reduces the solution space and enhances the overall placement quality. (2) Additionally, we propose a relaxation algorithm to minimize the number of boolean variables and further narrow down the solution space. This approach enables more efficient placement results by considering the problems specific constraints. Experimental results show that the proposed framework produces 7.7× speed up and 66% cost reduction.
Authors
- Bei Yu (ORCID: https://orcid.org/0000-0001-6406-4810)
- Tsung-Yi Ho (ORCID: https://orcid.org/0000-0001-7348-5625)
- Weihua Sheng (ORCID: https://orcid.org/0009-0000-0810-2042)
- Zhen Zhuang (ORCID: https://orcid.org/0000-0002-2972-8770)
- Shanyi Li (ORCID: https://orcid.org/0009-0008-0971-070X)
- Mingyu Liu (ORCID: https://orcid.org/0000-0001-9905-4399)
Institutions
- Chinese University of Hong Kong (HK)
- Huawei Technologies (China) (CN)
- Cloud Computing Center (CN)
- Huawei Technologies (United States) (US)
Publication Details
- Journal
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
- Published
- 2025-06-17
- DOI
- https://doi.org/10.1109/tcad.2025.3580511
- Primary Topic
- Modular Robots and Swarm Intelligence
- Type
- article
- Field-Weighted Citation Impact
- 0.00