Atmospheric neutron-induced single-event burnout in <b> <i>β</i> </b>-Ga2O3 Schottky barrier diode

This paper investigates the single-event burnout (SEB) effect of β-Ga2O3 Schottky barrier diode (SBD) under atmospheric neutron irradiation, including the degradation modes and physical mechanisms. The experimental results indicate that the reverse bias voltage (UR) is a critical factor influencing SEB failure of β-Ga2O3 SBD devices. When UR reaches 600 V, SEB failure occurs, characterized as a sudden loss of voltage-blocking capability during atmospheric neutron irradiation. The Emission Microscope and Scanning Electron Microscopy analysis reveal that SEB events occur at the edge of the Schottky junction, with the damaged area forming an approximately elliptical molten “void.” Geant 4 and TCAD simulation results show that the incidence of secondary ions, such as Cr, causes a rise in the lattice temperature inside the device, with the maximum lattice temperature increasing as UR increases. When UR is sufficiently high, the local lattice temperature reaches the melting point of the Ga2O3 material, ultimately leading to SEB failure. This study provides valuable theoretical support for Ga2O3-based power devices in aerospace applications.

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Publication Details

Journal
Applied Physics Letters
Published
2025-06-16
DOI
https://doi.org/10.1063/5.0273065
Citations
2
Primary Topic
Ga2O3 and related materials
Type
article
Field-Weighted Citation Impact
0.85

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Atmospheric neutron-induced single-event burnout in β -Ga2O3 Schottky barrier diode

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2 citations
Applied Physics Letters
Ga2O3 and related materials
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article

Atmospheric neutron-induced single-event burnout in β -Ga2O3 Schottky barrier diode

Hong Zhang, Teng Ma, Chao Peng, Jia‐Yue Yang, Zhangang Zhang, Zhifeng Lei, Xing Li, Yuangang Wang, Xi Liang, Xing Zeng, Xiaoning Zhang, W. Z. Jiang
article en
2 citations

Abstract

This paper investigates the single-event burnout (SEB) effect of β-Ga2O3 Schottky barrier diode (SBD) under atmospheric neutron irradiation, including the degradation modes and physical mechanisms. The experimental results indicate that the reverse bias voltage (UR) is a critical factor influencing SEB failure of β-Ga2O3 SBD devices. When UR reaches 600 V, SEB failure occurs, characterized as a sudden loss of voltage-blocking capability during atmospheric neutron irradiation. The Emission Microscope and Scanning Electron Microscopy analysis reveal that SEB events occur at the edge of the Schottky junction, with the damaged area forming an approximately elliptical molten “void.” Geant 4 and TCAD simulation results show that the incidence of secondary ions, such as Cr, causes a rise in the lattice temperature inside the device, with the maximum lattice temperature increasing as UR increases. When UR is sufficiently high, the local lattice temperature reaches the melting point of the Ga2O3 material, ultimately leading to SEB failure. This study provides valuable theoretical support for Ga2O3-based power devices in aerospace applications.

Applied Physics LettersVol. 126(24)
Xidian University (CN), University of Electronic Science and Technology of China (CN), Shandong University (CN), China Electronic Product Reliability and Environmental Test Institute (CN), Hebei Semiconductor Research Institute (CN)
National Natural Science Foundation of China, Basic and Applied Basic Research Foundation of Guangdong Province
Openalex Percentile: Top 27%
Ga2O3 and related materials
0.85
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