Additive manufacturing of hybrid bond grinding wheels via digital light processing: Performance enhancement through composition alteration and groove incorporation

• Customized hybrid bond grinding wheels were additionally manufactured using DLP • Profile accuracy is notably enhanced through composition and geometry alteration • Grooved wheel design reduced cutting forces by up to 60% in experimental tests • Increased metal content improved surface finish by up to 44% • Printed hybrid-bond wheels showed strong grain retention and reduced pull-out Hybrid bond grinding wheels, which combine the flexibility of resin bonds with the strength and thermal stability of metal bonds, are emerging as a promising solution for high-performance grinding applications. However, their fabrication remains complex and largely unexplored through additive manufacturing techniques. This study introduces a novel approach to producing hybrid (resin-metal) bond silicon carbide (SiC) grinding wheels using the Digital Light Processing (DLP) method, an accessible, affordable, and precise additive manufacturing technology. To investigate the influence of composition and structure, four distinct formulations were fabricated and tested in the flat surface grinding of aluminum. The best-performing composition was then used to manufacture a structured grinding wheel with helical grooves for further evaluation. Experimental results demonstrated that increasing the metal and abrasive content extended tool life by up to 28% and enhanced profile accuracy and surface finish by up to 44%. Additionally, the grooved wheel design reduced cutting forces by up to 60%, improved profile accuracy, and marginally extended tool life. This work provides the first comprehensive demonstration of DLP-fabricated hybrid bond grinding wheels, establishing a foundation for customizable, high-efficiency grinding tools tailored through additive manufacturing.