AlGaN/GaN HEMTs on Si by Self-Aligned TaN Contact Ledge for Low-Voltage RF Applications

We propose a self-aligned contact ledge structure to achieve the small ohmic contact resistance (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$R_{\text {c}}$</tex-math> </inline-formula>) of GaN-based high electron mobility transistors (HEMTs) on Si for low-voltage RF applications. Without additional photolithography processes, the ledge structure is achieved by magnetron sputtering with good particle filling on the sidewall. Due to the good coverage of sputtered Ta, the self-aligned TaN contact ledge not only has a clear boundary after high-temperature annealing but also introduces an additional current path to reduce <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>-resistance (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${R} _{\text {on}}$</tex-math> </inline-formula>), which is important for fabricating devices for low-voltage RF applications. Benefiting from the contact ledge structure and the low sheet resistance high Al component Al<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.6</sub>Ga<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.4</sub>N/GaN epitaxy, a low <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${R} _{\text {on}}$</tex-math> </inline-formula> of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$1.12~\Omega \cdot $</tex-math> </inline-formula>mm is obtained and the peak transconductance increased by 13%. At 3.5 GHz and operating voltage 5 V, the power-added efficiency (PAE) is 67.0% and the output power density (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${P} _{\text {out}}$</tex-math> </inline-formula>) is 0.75 W/mm. The PAE is 8.5% higher than that of noncontact ledge.

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Journal
IEEE Microwave and Wireless Technology Letters
Published
2025-06-16
DOI
https://doi.org/10.1109/lmwt.2025.3578128
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.00

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article

AlGaN/GaN HEMTs on Si by Self-Aligned TaN Contact Ledge for Low-Voltage RF Applications

Jingxiong Chen, Xiao Ma, Yuanda Zheng, Hong Wang et al.
1 links
IEEE Microwave and Wireless Technology Letters
GaN-based semiconductor devices and materials
article

AlGaN/GaN HEMTs on Si by Self-Aligned TaN Contact Ledge for Low-Voltage RF Applications

Jingxiong Chen, Xiao Ma, Yuanda Zheng, Hong Wang, Yuanxi Jiang, Weiyuan Wang
article en

Abstract

We propose a self-aligned contact ledge structure to achieve the small ohmic contact resistance (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$R_{\text {c}}$</tex-math> </inline-formula>) of GaN-based high electron mobility transistors (HEMTs) on Si for low-voltage RF applications. Without additional photolithography processes, the ledge structure is achieved by magnetron sputtering with good particle filling on the sidewall. Due to the good coverage of sputtered Ta, the self-aligned TaN contact ledge not only has a clear boundary after high-temperature annealing but also introduces an additional current path to reduce <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>-resistance (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${R} _{\text {on}}$</tex-math> </inline-formula>), which is important for fabricating devices for low-voltage RF applications. Benefiting from the contact ledge structure and the low sheet resistance high Al component Al<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.6</sub>Ga<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.4</sub>N/GaN epitaxy, a low <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${R} _{\text {on}}$</tex-math> </inline-formula> of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$1.12~\Omega \cdot $</tex-math> </inline-formula>mm is obtained and the peak transconductance increased by 13%. At 3.5 GHz and operating voltage 5 V, the power-added efficiency (PAE) is 67.0% and the output power density (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${P} _{\text {out}}$</tex-math> </inline-formula>) is 0.75 W/mm. The PAE is 8.5% higher than that of noncontact ledge.

IEEE Microwave and Wireless Technology LettersVol. 35(9)
South China University of Technology (CN)
Science and Technology Development Fund
Affordable and clean energy
Openalex Percentile: Top 91%
GaN-based semiconductor devices and materials
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