Analysis of Equivalent Material Properties in Ceramic-Packaged SiC PiN Diodes : Experimental and Simulation Study

This study investigates the electrical and thermal characteristics of SiC PiN diodes mounted on a ceramic package through both experimental measurements and finite element analysis (FEA). The research focuses on evaluating the impact of packaging process variations on the equivalent material properties of the device. Electrical resistivity and thermal conductivity were extracted from 22 samples and compared to assess process-induced deviations. The results indicate that variations in wire bonding and die bonding significantly influence the device’s electrical resistance and thermal conductivity. In particular, samples with lower electrical resistance exhibited higher thermal conductivity, suggesting that packaging quality plays a crucial role in overall device performance. Furthermore, the equivalent material properties derived from experimental data were applied to the simulation model, demonstrating strong correlation with the measured values. This approach provides a systematic method for quantifying process-induced variability in power semiconductor packaging and offers insights for optimizing package reliability. The findings of this study contribute to the enhancement of power semiconductor packaging by enabling a more accurate and efficient evaluation of material properties, ultimately improving device performance and thermal management strategies.