Analysis of Switching Characteristics of TO-247-3L and TO-247-4L SiC MOSFETs Based on Chip Size and Temperature Variations

Silicon-Carbide Metal-Oxide-Semiconductor Field-Effect Transistors (SiC MOSFETs) are crucial for next-generation power conversion. Conventional SiC MOSFETs primarily utilize a 3-lead package, which is simple in structure and cost-effective. However, the common source inductance of the package increases switching losses. To address this issue, a 4-lead package has been introduced. Nevertheless, research on its switching characteristics is still limited. This study compares the switching characteristics of TO-247-3L and TO-247-4L SiC MOSFETs with identical chip sizes through double pulse tests. Moreover, switching losses under different temperature conditions were analyzed for various chip sizes of TO-247-3L and TO-247-4L SiC MOSFETs. The findings indicate that switching losses of TO-247-4L SiC MOSFETs were lower than TO-247-3L SiC MOSFETs. Additionally, turn-off energy losses increased with temperature, while turn-on energy losses varied depending on chip sizes and package types.

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Publication Details

Journal
The Transactions of The Korean Institute of Electrical Engineers
Published
2025-05-31
DOI
https://doi.org/10.5370/kiee.2025.74.5.917
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
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article

Analysis of Switching Characteristics of TO-247-3L and TO-247-4L SiC MOSFETs Based on Chip Size and Temperature Variations

Jungkyo Jung, Hyun-Yong Park, Hye-Min Kang, Yong‐Jin Seo et al.
The Transactions of The Korean Institute of Electrical Engineers
Silicon Carbide Semiconductor Technologies
article

Analysis of Switching Characteristics of TO-247-3L and TO-247-4L SiC MOSFETs Based on Chip Size and Temperature Variations

Jungkyo Jung, Hyun-Yong Park, Hye-Min Kang, Yong‐Jin Seo, Sung-Min Choi
article en

Abstract

Silicon-Carbide Metal-Oxide-Semiconductor Field-Effect Transistors (SiC MOSFETs) are crucial for next-generation power conversion. Conventional SiC MOSFETs primarily utilize a 3-lead package, which is simple in structure and cost-effective. However, the common source inductance of the package increases switching losses. To address this issue, a 4-lead package has been introduced. Nevertheless, research on its switching characteristics is still limited. This study compares the switching characteristics of TO-247-3L and TO-247-4L SiC MOSFETs with identical chip sizes through double pulse tests. Moreover, switching losses under different temperature conditions were analyzed for various chip sizes of TO-247-3L and TO-247-4L SiC MOSFETs. The findings indicate that switching losses of TO-247-4L SiC MOSFETs were lower than TO-247-3L SiC MOSFETs. Additionally, turn-off energy losses increased with temperature, while turn-on energy losses varied depending on chip sizes and package types.

The Transactions of The Korean Institute of Electrical EngineersVol. 74(5)
Affordable and clean energy
Openalex Percentile: Top 88%
Silicon Carbide Semiconductor Technologies
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