Analysis of Stress Field and Elastoplastic Removal Mechanism in Sapphire Magnetic Compound Fluid Polishing

本文针对蓝宝石在磁性复合流体抛光中应力分布和材料去除机制开展研究，基于最小二乘法对实测轮廓进行高阶多项式拟合，准确反映抛光斑的真实三维形貌特征，结合Reynolds方程，仿真分析抛光区域压力，获得抛光区流体动压力分布规律，与实际抛光斑的几何特征具有高度一致性，结合Hertz接触理论，揭示了材料去除机制为弹塑性去除。 This paper investigates the stress distribution and material removal mechanism of sapphire in magnetic composite fluid polishing. Based on the least squares method, the measured profile is fitted with a high-order polynomial to accurately reflect the true three-dimensional topographic characteristics of the polished spot. Combined with the Reynolds equation, the pressure in the polishing area is simulated and analyzed, yielding the distribution law of hydrodynamic pressure in the polishing zone, which exhibits high consistency with the geometric features of the actual polished spot. Furthermore, by integrating Hertz contact theory, it is revealed that the material removal mechanism follows an elastic-plastic removal mode.