Flow Field Simulation and Modeling Analysis of Micro-Textured Magnetic Compound Fluid Polishing
计算流体力学(Computational Fluid Dynamics)方法因其在流场分析中的广泛应用而被广泛认可。CFD仿真能够提供详细的流场信息,帮助提高材料去除效率和表面质量。因此,本章将利用COMSOL Multiphysics有限元软件对MCF抛光液的运动特性进行研究。材料去除率作为一个关键的性能指标,不仅影响加工效率,还与加工表面质量相关。在材料去除率的理论基础下,可知抛光压力和抛光速度是影响材料去除率的两个因素。传统抛光工件表面相对平整、不存在微结构特征,使得抛光过程中的速度和压力分布较为一致。然而,微织构工件由于其表面存在微结构阵列特征,使得抛光过程中的速度和压力分布呈现出非均匀性,对材料去除率会产生影响。因此,借助有限元仿真对速度和压力分布进行模拟,帮助理解微织构抛光过程中的材料去除行为。通过有限元仿真,分析在不同的抛光间隙和抛光转速条件下,MCF抛光液的流速分布和压力分布以及剪切速率情况。为后续进行MCF微织构抛光试验提供指导与参考依据。The method of Computational Fluid Dynamics (CFD) has garnered widespread recognition due to its extensive application in fluid flow analysis. CFD simulations are capable of providing detailed information about fluid flow fields, thereby facilitating enhanced material removal efficiency and surface quality. Consequently, this chapter employs the COMSOL Multiphysics finite element software to investigate the flow characteristics of MCF (Magnetic Compound Fluid) polishing fluid. Material removal rate, as a pivotal performance indicator, not only influences the efficiency of the machining process but is also intrinsically linked to the surface quality of the workpiece. Based on the theoretical foundation of material removal rate, it is evident that polishing pressure and polishing speed are two factors that affect the material removal rate. Traditional polished workpieces, characterized by relatively flat surfaces devoid of microstructural features, exhibit uniform distributions of speed and pressure during the polishing process. However, micro-textured workpieces, which possess microstructural arrays on their surfaces, display non-uniform distributions of speed and pressure during polishing, thereby affecting the material removal rate. Therefore, finite element simulations are utilized to model the distributions of speed and pressure, aiding in the comprehension of material removal behavior in micro-textured polishing processes. Through finite element simulations, the velocity and pressure distributions of the MCF polishing fluid, as well as the shear rate, are analyzed under different polishing gap and polishing speed conditions. This provides guidance and a reference for subsequent MCF micro-textured polishing experiments.
Authors
- 世炜 许
Publication Details
- Journal
- Modeling and Simulation
- Published
- 2025-01-01
- DOI
- https://doi.org/10.12677/mos.2025.146484
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00