Optimum Grounded Coplanar Waveguide to Microstrip Transition in RF Front End Systems Using TGV Technique

This paper presents an optimized grounded coplanar waveguide (GCPW) to microstrip transition for RF front-end systems, employing through-glass-via (TGV) technology to enhance signal integrity and performance. The proposed design, featuring cut-corner and via hole configurations, significantly improves return loss and reduces insertion loss, addressing the critical impedance matching challenge in high-frequency applications. Utilizing High-Frequency Structure Simulator (HFSS), we demonstrate a return loss enhancement of over 5 dB and an insertion loss reduction of 0.5 dB across the 500 MHz to 20 GHz frequency band, essential for the development of compact, efficient RF front-end modules suitable for advanced wireless communication systems.