Dynamic Flash Memory Operation Experimentally Validated with 65nm SOI Technology

Dynamic Flash Memory (DFM) have been fabricated on 300 mm SOI wafers with 65 nm technology, experimentally validating a wide "1" and "0" margin for the first time. The proposed device operates exclusively with positive polarity signals, eliminating the need for negative voltages. Thanks to its unique split-gate structure, a long retention time of over 10 seconds at 85 ℃, and a robust Bit Line (BL) disturbance time of 10 ms with the BL stress voltage (VSBL) of 2.5 V are demonstrated.

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Publication Details

Published
2025-05-18
DOI
https://doi.org/10.1109/imw61990.2025.11026959
Primary Topic
Advanced Memory and Neural Computing
Type
article
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Dynamic Flash Memory Operation Experimentally Validated with 65nm SOI Technology

Eyüp Can Demir, Yisuo Li, Yiqun Wan, A. Fantini et al.
Advanced Memory and Neural Computing
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Dynamic Flash Memory Operation Experimentally Validated with 65nm SOI Technology

Eyüp Can Demir, Yisuo Li, Yiqun Wan, A. Fantini, Christophe Lorant, M. Kakumu, I. Kunishima, Koji Sakui, Daniele Garbin, K. Kanazawa, Gautam Gaddemane, Yoshihisa Iwata, Nozomu Harada
article en

Abstract

Dynamic Flash Memory (DFM) have been fabricated on 300 mm SOI wafers with 65 nm technology, experimentally validating a wide "1" and "0" margin for the first time. The proposed device operates exclusively with positive polarity signals, eliminating the need for negative voltages. Thanks to its unique split-gate structure, a long retention time of over 10 seconds at 85 ℃, and a robust Bit Line (BL) disturbance time of 10 ms with the BL stress voltage (VSBL) of 2.5 V are demonstrated.

IMEC (BE)
Affordable and clean energy
Openalex Percentile: Top 89%
Advanced Memory and Neural Computing
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