Test Method and Validation of Equivalent Thermal Conductivity of Three-dimensional Lattice Structure Plate for Satellite Application

The three-dimensional lattice structure has garnered significant attention in satellite applications due to its exceptional lightweight properties, high load-bearing capacity, and effective electromagnetic shielding capabilities. The application of three-dimensional lattice structure panels in satellites requires adherence to strict thermal management requirements. This study investigates the test method for the equivalent thermal conductivity of a three-dimensional lattice structure plate made of PEEK material. Initially, a theoretical model for the thermal conductivity of the Gyroid structure unit within the three-dimensional lattice structure plate was analyzed, followed by finite element simulations of the temperature field within the unit. Subsequently, the equivalent thermal conductivity of the unit is incorporated into the theoretical and simulation calculations of the thermal conduction model for the panel. Finally, a comparative heat flow meter method was employed to experimentally determine the equivalent thermal conductivity of the satellite three-dimensional lattice structure plate under various operational conditions. Although the experimental results were marginally lower than theoretical and simulation predictions, the overall trends demonstrated substantial consistency, thus validating the efficacy of the proposed equivalent thermal conductivity test methodology. This provides crucial support for the application of three-dimensional lattice structures in future high-performance satellites.