Towards electrical insulation electromagnetic interference shielding materials: a magnetic network–microcapacitor framework for advanced electronic packaging
To meet the challenges of Moore's law, next-generation chips have been constructed with increasingly complex multilayer architectures.
Authors
- Zeyu Zheng (ORCID: https://orcid.org/0000-0001-5653-152X)
- Weijing Wu (ORCID: https://orcid.org/0000-0002-7574-5117)
- Yan‐Jun Wan (ORCID: https://orcid.org/0000-0002-8033-3328)
- Jianhui Zeng (ORCID: https://orcid.org/0009-0006-1161-2004)
- Jialin Wen (ORCID: https://orcid.org/0000-0003-3328-3265)
- Pengli Zhu (ORCID: https://orcid.org/0000-0001-6830-7760)
- Hebin Zhang (ORCID: https://orcid.org/0000-0001-5459-9408)
- Yang Liu (ORCID: https://orcid.org/0000-0003-1859-6300)
- Ting Xin (ORCID: https://orcid.org/0000-0002-8351-1919)
- Xinyin Gu
- Rong Sun
Institutions
- Chinese Academy of Sciences (CN)
- Shenzhen Institutes of Advanced Technology (CN)
- South China University of Technology (CN)
Publication Details
- Journal
- Journal of Materials Chemistry A
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5ta03071d
- Citations
- 3
- Primary Topic
- Electromagnetic wave absorption materials
- Type
- article
- Field-Weighted Citation Impact
- 1.28