Modular perspective on talent chain collaboration and gradient growth in strategic emerging industries: a mixed-methods study of integrated circuit talent

The development of the integrated circuit (IC) industry is essential for China to secure a strategic advantage in international competition, with IC talent serving as the critical support for advanced process R&D and product yield. This study, adopting a modular perspective on talent, explores both the horizontal chain collaboration model and vertical gradient growth paths of IC talent across the entire industry chain. By integrating text modeling, tree generation analysis, and qualitative research methods, the study examines recruitment data, talent resumes, and other textual materials from the IC sector. The findings reveal that the IC industry is composed of three modules: IC design, front-end processes, and back-end processes. Each module has distinct work characteristics—precision integration, standard processes, and linear procedures—requiring talents with a combination of broad expertise, technical proficiency, and meticulous control. These requirements, in turn, foster a horizontal chain collaboration model among the modules. Additionally, IC talent within these modules follows differentiated gradient growth paths, such as neighborhood integration, skill refinement, and intra-domain mobility. These paths necessitate embedded education, mentorship systems, and skill certification to support vertical growth within each module. Based on these empirical insights, the study develops theoretical propositions on talent modularity within strategic emerging industries, addressing existing research gaps and offering practical guidance for talent development in these sectors.