Large-Scale and Ultraclean Dry Transfer of Two-Dimensional Materials via Liquid Nitrogen-Assisted Cryogenic Exfoliation
Transition metal dichalcogenides (TMDCs) hold significant promise in constructing next-generation high-performance electronic devices, potentially extending Moore's law and enabling the realization of three-dimensional integrated circuit architectures. However, realizing this potential depends critically on developing a reliable method to transfer TMDCs from a growth substrate to desirable surfaces. Here, we report a dry-transfer strategy of liquid nitrogen-assisted cryogenic exfoliation to achieve large-scale and superclean transfer of TMDCs. Benefited from the synergistic effect of liquid nitrogen-induced exfoliation and protection of hafnium oxide, the transferred TMDCs are free from polymer residues and show excellent electrical property, and taking n-type single-crystal molybdenum disulfide as a demonstration, the transferred TMDC exhibits high carrier mobility up to 38.4 cm<sup>2</sup> V<sup>-1</sup> s<sup>-1</sup>. Moreover, this transfer method shows versatile capabilities in transferring monolayer and multilayer TMDCs and constructing bi- and trilayer heterostructures. Therefore, our proposed transfer methodology promises the integration of TMDCs into future, ultimately scaled-down, electronic device technologies.
Authors
- Yafei Ning
- Gengchang Zhu (ORCID: https://orcid.org/0000-0002-8971-4960)
- Yu Sun (ORCID: https://orcid.org/0000-0002-2136-4466)
- Klaus Leifer (ORCID: https://orcid.org/0000-0002-8360-1877)
- Sabeen Fatima (ORCID: https://orcid.org/0000-0001-7173-1490)
- Ziheng Li (ORCID: https://orcid.org/0000-0003-2063-0328)
- Aimin M. Song (ORCID: https://orcid.org/0000-0001-6550-518X)
- Safia Khan (ORCID: https://orcid.org/0000-0003-0708-4588)
- Hu Li (ORCID: https://orcid.org/0000-0003-1050-8441)
- Lei Han (ORCID: https://orcid.org/0009-0000-9840-4692)
- Xiaoxiao Zheng (ORCID: https://orcid.org/0009-0009-1390-6665)
Institutions
- Shandong University of Technology (CN)
- Uppsala University (SE)
- Shandong University (CN)
- Center for NanoScience (DE)
- University of Manchester (GB)
- Southern University of Science and Technology (CN)
- City University of Hong Kong, Shenzhen Research Institute (CN)
- Technology Centre Prague (CZ)
Publication Details
- Journal
- Nano Letters
- Published
- 2025-06-11
- DOI
- https://doi.org/10.1021/acs.nanolett.5c01548
- Citations
- 8
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 5.84
Funders
- Royal Society
- National Natural Science Foundation of China
- Natural Science Foundation of Shandong Province
- Shenzhen Fundamental Research Program
- Key Technology Research and Development Program of Shandong
- National Key Research and Development Program of China
- Shandong Provincial Postdoctoral Science Foundation
- Basic and Applied Basic Research Foundation of Guangdong Province