Fracture Toughness of 3D Printed Metal Wire Composites

Abstract Additive manufacturing of wire-embedded electronics is an emerging research area with significant potential. By incorporating multiple materials into a monolithic structure through additive manufacturing, the production chain for embedded electronics is simplified. While the manufacturing of embedded electronics has garnered substantial attention, there remains a knowledge gap in understanding the mechanical properties of these multi-material structures. This paper addresses the fracture toughness characterization of metal wire-embedded composites produced using material extrusion 3D printing. Metal wire embedded single leg bending (SLB) specimens were fabricated using the pause and go technique in a desktop scale 3D printer. The SLB samples were printed from polylactic acid (PLA) and Acrylonitrile Butadiene Styrene (ABS) with 0° and 90° raster orientations. Two groups of specimens were characterized: (a) as-fabricated specimens and (b) Joule heating specimens. Specimens were loaded under the quasi-static three-point bending condition to initiate the fracture between the PLA/wire/PLA interface and ABS/wire/ABS interface. Fracture testing results showed that 0° raster orientation samples exhibited higher average toughness energy compared to the 90° orientation. This study provides valuable insights into the were embedded and reinforced part that are fabricated via additive manufacturing, demonstrating their potentials for multi-materials composite structures.

Authors

Institutions

Publication Details

Published
2025-05-05
DOI
https://doi.org/10.1115/ssdm2025-152575
Primary Topic
Additive Manufacturing and 3D Printing Technologies
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Fracture Toughness of 3D Printed Metal Wire Composites

Kazi Md Masum Billah, Syed Hasib Akhter Faruqui, Adam Kennedy, Jeffrey David Gleasman
4 links
Additive Manufacturing and 3D Printing Technologies
article

Fracture Toughness of 3D Printed Metal Wire Composites

Kazi Md Masum Billah, Syed Hasib Akhter Faruqui, Adam Kennedy, Jeffrey David Gleasman
article en

Abstract

Abstract Additive manufacturing of wire-embedded electronics is an emerging research area with significant potential. By incorporating multiple materials into a monolithic structure through additive manufacturing, the production chain for embedded electronics is simplified. While the manufacturing of embedded electronics has garnered substantial attention, there remains a knowledge gap in understanding the mechanical properties of these multi-material structures. This paper addresses the fracture toughness characterization of metal wire-embedded composites produced using material extrusion 3D printing. Metal wire embedded single leg bending (SLB) specimens were fabricated using the pause and go technique in a desktop scale 3D printer. The SLB samples were printed from polylactic acid (PLA) and Acrylonitrile Butadiene Styrene (ABS) with 0° and 90° raster orientations. Two groups of specimens were characterized: (a) as-fabricated specimens and (b) Joule heating specimens. Specimens were loaded under the quasi-static three-point bending condition to initiate the fracture between the PLA/wire/PLA interface and ABS/wire/ABS interface. Fracture testing results showed that 0° raster orientation samples exhibited higher average toughness energy compared to the 90° orientation. This study provides valuable insights into the were embedded and reinforced part that are fabricated via additive manufacturing, demonstrating their potentials for multi-materials composite structures.

Sam Houston State University (US), University of Houston - Clear Lake (US)
Openalex Percentile: Top 87%
Additive Manufacturing and 3D Printing Technologies
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.