A 5–18 GHz Four-Channel Multifunction Chip Using 3D Heterogeneous Integration of GaAs pHEMT and Si-CMOS

Compact, broadband, multi-channel RF chips with low loss and high integration are required for high-performance phased-array systems. Presented in this paper is a four-channel, multifunction RF chip operating in the 5–18 GHz frequency range that integrates broadband phase shifting, amplitude control, power amplification, and switching functions. The chip is designed to have flip-chip bonding and stacked gold bumps to enable the compact 3D integration of the GaAs pHEMT and Si-CMOS. To ensure high-density interconnects with minimal parasitic effects, a fan-in redistribution process is implemented. The RF front-end part of this chip, fabricated through a 0.15 µm GaAs pHEMT process, integrates 6-bit digital phase shifters, 6-bit digital attenuators, low-noise amplifiers (LNAs), power amplifiers (PAs), and single-pole double-throw (SPDT) switches. To enhance multi-channel isolation and reduce crosstalk between RF chips and digital circuits, high isolation techniques, including a ground-coupled shield layer in the fan-in process and on-chip shield cavities, are utilized, which achieve isolation levels greater than 41 dB between adjacent RF channels. The measurement results demonstrate a reception gain of 0 dB with ±0.6 dB flatness, an NF below 11 dB, and transmit gain of more than 10 dB, with a VSWR of below 1.6 over the entire 5–18 GHz frequency band. The 6-bit phase shifter achieves a root mean square (RMS) phase error below 2.5° with an amplitude variation of less than 0.8 dB, while the 6-bit attenuator exhibits an RMS attenuation error of below 0.5 dB and a phase variation of less than 7°. The RF and digital chips are heterogeneously integrated using flip-chip and fan-in technology, resulting in a compact chip size of 6.2 × 6.2 × 0.33 mm3. These results validate that this is a compact, high-performance solution for advanced phased-array radar applications.