Three Decades of Thermal Management Research at DARPA

Abstract Since its founding in 1992, Microsystems Technology Office at DARPA has invested in transformative advances in the field of semiconductor devices. These devices, pervasive in all microsystems, are operated within an economic life, dependent on both the material life of the semiconductor and the mechanical life of the electronics package housing the devices. Thermal management solutions directly impact the performance and reliable operational lifetime of microsystems. Multiscale and multiphysics codesign of microsystems can maximize their performance and reliability. The various DARPA programs in the area of thermal management over three decades are summarized here, along with the demonstrated advancements in each program. Current efforts on 3D heterogeneous integration, multiscale modeling, and high power GaN power amplifiers are also discussed.