Reliability Modeling and Evaluation of Circuit Boards Considering Key Design Factors

This paper examines the impact of key design factors on the failure time and reliability of circuit boards in thermal vibration environments. It proposes methodologies for constructing a surrogate model to predict failure time based on these design factors and for assessing the reliability of circuit boards. The research begins by analyzing the external influences and critical design factors affecting circuit board performance. An experimental design is implemented using the Latin hypercube sampling method to ensure comprehensive coverage of variable interactions. Next, finite element simulation is employed to perform thermal vibration analyses, and the resulting data is used to calculate the failure time of circuit boards. Following this, a Kriging surrogate model is developed to accurately fit the high-dimensional, nonlinear relationship between design factors and failure time. The model effectively captures the complex interactions among these variables. Subsequently, the uncertainty characteristics of the system are quantified and represented, enabling more precise parameter estimation of the lifetime distribution. This is achieved using the Monte Carlo method, which provides detailed insights into the reliability assessment. Finally, the feasibility and effectiveness of the proposed modeling and assessment methodologies are validated through case studies, demonstrating their practical applicability in engineering scenarios.