Bonding Hierarchy and Phonon Coherence Enhanced Ultralow Lattice Thermal Conductivity and Excellent Thermoelectric Properties in Cs<sub>2</sub>TeI<sub>6</sub>

Abstract Lead-free halide perovskites provide a promising solution for efficient thermoelectric materials due to their ultralow lattice thermal conductivity ( κ L ). However, disadvantages such as the electrically resistive nature strongly affect their power factor. In this work, we introduced the Te-based halide perovskites thermoelectric material Cs 2 TeI 6 , which is already known as a promising candidate for photovoltaic applications due to its moderate band gap. Our findings reveal that Cs 2 TeI 6 has an exceptionally ultralow κ L at room temperature, reaching as low as 0.17 W⋅m −1 ⋅K −1 . We found that the four-phonon scattering processes play a dominant role in suppressing the thermal transport, leading to an approximate 50% reduction in its particle-like thermal conductivity κ p at 300 K. The ultralow κ L can be mainly attributed to the strong discrepancy in bonding strength, which induces large anharmonicity. The flat and dense phonon dispersions result in a strong phonon scattering rate, making it easy to generate wavelike phonon tunneling. After accounting for the wavelike thermal conductivity κ c , a nonstandard T −0.30 temperature dependence was observed. Benefiting from the ultralow κ L , n-type Cs 2 TeI 6 is predicted to achieve an extraordinary ZT of 2.26 at 700 K. This work highlights a pathway for searching high-performance and low-cost thermoelectrics based on lead-free halide perovskites.

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Publication Details

Journal
Chinese Physics Letters
Published
2025-06-08
DOI
https://doi.org/10.1088/0256-307x/42/8/080703
Citations
5
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
Field-Weighted Citation Impact
2.59
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article

Bonding Hierarchy and Phonon Coherence Enhanced Ultralow Lattice Thermal Conductivity and Excellent Thermoelectric Properties in Cs2TeI6

Jiang‐Jiang Ma, Bao‐Tian Wang, Jingjing Zheng, Chao‐Jun Li et al.
5 citations
Chinese Physics Letters
Advanced Thermoelectric Materials and Devices
2.59
article

Bonding Hierarchy and Phonon Coherence Enhanced Ultralow Lattice Thermal Conductivity and Excellent Thermoelectric Properties in Cs2TeI6

Jiang‐Jiang Ma, Bao‐Tian Wang, Jingjing Zheng, Chao‐Jun Li, Rongrong Ma
article en
5 citations

Abstract

Abstract Lead-free halide perovskites provide a promising solution for efficient thermoelectric materials due to their ultralow lattice thermal conductivity ( κ L ). However, disadvantages such as the electrically resistive nature strongly affect their power factor. In this work, we introduced the Te-based halide perovskites thermoelectric material Cs 2 TeI 6 , which is already known as a promising candidate for photovoltaic applications due to its moderate band gap. Our findings reveal that Cs 2 TeI 6 has an exceptionally ultralow κ L at room temperature, reaching as low as 0.17 W⋅m −1 ⋅K −1 . We found that the four-phonon scattering processes play a dominant role in suppressing the thermal transport, leading to an approximate 50% reduction in its particle-like thermal conductivity κ p at 300 K. The ultralow κ L can be mainly attributed to the strong discrepancy in bonding strength, which induces large anharmonicity. The flat and dense phonon dispersions result in a strong phonon scattering rate, making it easy to generate wavelike phonon tunneling. After accounting for the wavelike thermal conductivity κ c , a nonstandard T −0.30 temperature dependence was observed. Benefiting from the ultralow κ L , n-type Cs 2 TeI 6 is predicted to achieve an extraordinary ZT of 2.26 at 700 K. This work highlights a pathway for searching high-performance and low-cost thermoelectrics based on lead-free halide perovskites.

Chinese Physics LettersVol. 42(8)
Taiyuan Normal University (CN), Chinese Academy of Sciences (CN), China Spallation Neutron Source (CN), Institute of High Energy Physics (CN), Shanxi Normal University (CN)
Openalex Percentile: Top 10%
Advanced Thermoelectric Materials and Devices
2.59
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