Performance of Compound Wavy Microchannel Heat Sinks With Varying Wavelengths and Amplitudes in Terms of Thermo‐Hydraulics

ABSTRACT Microchannel heat sinks (MCHS) have emerged as a reliable solution for effective thermal management in compact and high‐performance electronic devices. This study presents a detailed investigation of a porous/solid compound wavy microchannel heat sink, designed with varying wavelengths and amplitudes, and operating within a Reynolds number range of 50 to 300. The performance of this innovative design is benchmarked against traditional straight‐channel heat sinks to assess its advantages. The thermal–hydraulic characteristics of the wavy MCHS and the flow behavior within its porous zones are analyzed using the finite volume method and Darcy–Forchheimer flow models, respectively. The heat sink structure, including its walls and fins, is constructed from copper, with water serving as the working fluid flowing through the channels. The study further examines how changes in amplitude and wavelength influence the heat sink's performance. Results reveal that hydraulic efficiency is maximized at higher wavelengths with lower amplitudes, while superior thermal performance is achieved with lower wavelengths and higher amplitudes. These enhancements are attributed to improved coolant mixing, driven by Dean vortices, and the permeation effects inherent to the porous zones. Consequently, the CWMCA200W2.0MM heat sink exhibits a PEF value of 2.22 at a Re of 300 when compared to straight‐channel heat sinks. Among the designs studied, the CWMCA200W2.0MM model stands out for its exceptional thermal and hydraulic performance, making it a highly effective solution for heat dissipation in advanced electronic devices.